JPH0650988Y2 - 半導体装置のリード成型装置 - Google Patents
半導体装置のリード成型装置Info
- Publication number
- JPH0650988Y2 JPH0650988Y2 JP9609588U JP9609588U JPH0650988Y2 JP H0650988 Y2 JPH0650988 Y2 JP H0650988Y2 JP 9609588 U JP9609588 U JP 9609588U JP 9609588 U JP9609588 U JP 9609588U JP H0650988 Y2 JPH0650988 Y2 JP H0650988Y2
- Authority
- JP
- Japan
- Prior art keywords
- die
- lead
- stripper
- bending
- spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 15
- 238000000465 moulding Methods 0.000 title description 3
- 238000005452 bending Methods 0.000 claims description 18
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Bending Of Plates, Rods, And Pipes (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9609588U JPH0650988Y2 (ja) | 1988-07-20 | 1988-07-20 | 半導体装置のリード成型装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9609588U JPH0650988Y2 (ja) | 1988-07-20 | 1988-07-20 | 半導体装置のリード成型装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0217853U JPH0217853U (en]) | 1990-02-06 |
| JPH0650988Y2 true JPH0650988Y2 (ja) | 1994-12-21 |
Family
ID=31320903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9609588U Expired - Lifetime JPH0650988Y2 (ja) | 1988-07-20 | 1988-07-20 | 半導体装置のリード成型装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0650988Y2 (en]) |
-
1988
- 1988-07-20 JP JP9609588U patent/JPH0650988Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0217853U (en]) | 1990-02-06 |
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